MaxCore™ PlatformVersatile and Dense Compute & Media Platform

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MaxCore™ Platform

The SMART Embedded Computing MaxCore™ platform offers a versatile and dense architecture to achieve maximum compute and media processing density. Through its use of SMART EC technology microserver cards, SMART EC media processing PCI Express cards and 3rd party PCI Express cards, it offers maximum flexibility, maximum density per rack unit (RU), and unmatched innovation in design for both datacenter and carrier grade applications.

Click here for information on payload cards available for the MaxCore Platform

2016 Product of the Year Award     Network Builders Award    

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  • 3U by 508 mm for 19” racks
  • Redundant 2200W from 90-264VAC or -48VDC
  • Highest performance density in 3U with 15 slots for SMART EC SharpServer™ microserver cards, with a total of 30 processors (two per card)
  • Redundant and hot-swappable cooling and power supply
  • Cable-less internal architecture for microserver cards
  • SMART EC SharpServer Intel® Xeon® processor D microserver cards
  • PCI Express and Ethernet networking infrastructures
  • 4 x 2.5” drive bays and 4x 10GBaseT built-in
  • Designed for NEBS and ETSI compliance
  • Multiple system configurations are possible: Any mix of microservers, SMART EC media processors and 3rd party PCI Express cards 

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SMART Embedded Computing (formerly Artesyn Embedded Computing) is part of the SMART Global Holdings, Inc family of companies.

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